In February, Intel announced that it is pushing back its timeframe for completing the two fabs. When Intel first announced Ohio as the site of its newest and most sophisticated chip manufacturing factories, company officials suggested the facilities could be done as early as 2025. But that aggressive goal will not be met. Typical construction timelines for semiconductor manufacturing facilities are three to five years from groundbreaking, depending on a range of factors. Intel broke ground on its Ohio One campus ahead of schedule in September 2022.

Since announcing its plans in early 2022, Intel has been a strong community partner for the City of New Albany. The company has reiterated its full commitment to the project, and we expect to see continued progress at the Ohio One site. The City of New Albany will continue to fulfill its commitments of completing related infrastructure, and we look forward to our continued partnership with Intel to bring silicon chip manufacturing to Ohio.

Intel broke ground on Ohio One ahead of schedule and is maintaining construction progress.  Typical construction timelines for semiconductor manufacturing facilities are three to five years from groundbreaking, depending on a range of factors.

Intel’s progress on the site as of May includes:

• More than 2.4 million work hours dedicated to the project.

• Poured more than 63,600 cubic yards of concrete, enough to fill two stadiums.

• Installed 9,400 tons of rebar (approximately the same weight as 1,300+ African elephants)

• Installed 46,700 linear feet of underground pipe (almost 2,180 parking spots end to end)

• Installed 238,200 linear feet of underground conduit (just over 800 football fields)

• Hired more than 100 Ohioans, including some who are training at Intel’s locations in Arizona and Oregon.

• 800-900 construction workers on the site and expect to have several thousand by the end of the year.